Call for Papers - Special Issue of "Embedded Systems Engineering"

Call for papers - Special Issue of "Embedded Systems Engineering"

March 10, 2023
Updated on May 10, 2023
Editorial Committee of the Journal of Information Processing

 Journal of Information Processing (JIP) is pleased to announce the call for papers for a special issue of Embedded Systems Engineering. This special issue targets state-of-the-art research results and case studies in embedded systems area as follows. This special issue is conducted by a guest editor system.
Prof. Kenji Hisazumi, Past Chair of Embedded System Symposium, Prof. Kiyofumi Tanaka, Chair of Special Interest Group of Embedded Systems, and Prof. Takeshi Ohkawa, Program Chair of Asia Pacific Conference on Robot IoT System Development and Platform (APRIS2020) are the guest editors of this special issue.
 Target Areas are following:
 Requirement Definition/Analysis Method, Developing Process, Design Methodology, Developing Environment, EDA, Co-design/Co-verification, Programming Language, Compiler, Low Power Technology, Dependable Systems, Verification, Test, Debugging Method/Tool, Performance Evaluation, Architecture, Processor, DSP, RTOS, Middleware, Network, Communication, Distributed Systems, Security, User Interface, Usability, Media Processing, Case Study,New Applications, Education, Training, Skill Standard, Collaboration with Industries and Universities, Project Management, Applications such as automobile, ITS, OA, Information Appliance, CPS (Cyber-Physical System), IoT (Internet of Things) and so on.
Journal of Information Processing (JIP) is currently encouraging more submissions from outside of Japan.
The publication fee of any accepted papers will not be charged if all the authors of the paper belong to institutes outside Japan.

Submission Guidelines

(1) All papers must be submitted electronically. Please access the following URL and proceed under the submission instructions:

Once you have submitted your manuscript, you cannot change it.
So, you must submit the final version of your manuscript.
If, by mistake, you submitted a wrong version, please contact the IPSJ secretariat <>(Replace -at- with @).

In the event you would like to make a submission, you must first create an account on the paper submission Web page. For detailed information, please refer to the manual available from the link “Instructions & Forms” at the top of the submission page.

(2) (Optional) If you submit a revised paper which was not accepted for the past special issues of JIP Embedded Systems Engineering, you can add a reply letter (free format) to the end of the manuscript PDF file in order to respond to the rejected reasons of your previous submission. A reply letter must include both the original rejected reasons and your response. Note that we do not guarantee that the same reviewers are assigned to your paper again and the reply letter is considered for your review results. We do not answer inquiries about rejected reasons of your past submissions.

(3) (Optional) You can add a cover letter (free format) when you submit your paper. A cover letter includes the abstract and the objectives of the study and its novel and/or practical aspects of the study.

(4) All papers will be reviewed. The review process will be carried out in the same manner as regular issues. However, you have shorter time than usual (eight weeks) for preparation of your responses to inquiries.

(5) Submission deadline is May 15, 2023 May 22, 2023. *Deadline extended

(6) The special issue will be published on the J-Stage website in February 2024. Preprint will be published on the IPSJ Journal in February 2024.

(7) The Editorial Committee of This Special Issue
Editor in-Chief: Kenji HISAZUMI (Shibaura Institute of Technology)
Deputy Chief Editor: Kiyofumi TANAKA (Japan Advanced Institute of Science and Technology), Takeshi OHKAWA (Tokai Univ.)
Editorial Committee: Takuya AZUMI (Saitama Univ.), Akio IDEHARA (Mitsubishi Electric), Masato EDAHIRO (Nagoya Univ.), Shinpei OGATA (Shinshu Univ.), Kozo OKANO (Shinshu Univ.), Kouichi ONO (IBM Research - Tokyo), Mizue KAYAMA (Shinshu Univ.), Kenji KISE (Tokyo Institute of Technology), Takashi KITAMURA (National Institute of Advanced Industrial Science and Technology), Ryo KURACHI (Nagoya Univ.), Masanori TAKAGI(The Univ. of Electro-Communications), Akira SUGANUMA (National Institute of Technology, Ariake College), Midori SUGAYA (Shibaura Institute of Technology), Mitsugu SUZUKI (Shimane Univ.), Yoshinori TAKEUCHI (Kindai Univ.), Kenji TEI (Waseda Univ.), Hironori NAKAJO (Tokyo Univ. of Agriculture and Technology), Hiroki NISHIKAWA (Osaka Univeristy), Natsuko NODA (Shibaura Institute of Technology),Mikio HASHIMOTO (Toshiba Electronic Devices & Storage Corp.), Eiichi HAYAKAWA (Takushoku Univ.), Hiroaki FUKUDA (Shibaura Institute of Technology), Takuya FUKUNAGA (Fukuoka Univ.), Shinya HONDA (Nanzan Univ.), Hiroki MATSUTANI (Keio Univ.), Yutaka MATSUBARA (Nagoya Univ.), Takanori YOKOYAMA (Tokyo City Univ.), Yasutaka WADA (Meisei Univ.)